SIMATIC D7-FB Generator V2.1 incl. Service Pack 2; Single License for 1 install., E-SW, SW and documentation on CD, Class A, 2 languages (de, en), executable in Win95/98/ME/ Windows NT/2000/XP, Reference HW: SIMATIC FM458, T400, SIMATIC TDC, SIMADYN D
ET 200SP HA mounting rail 482 mm (approx. 19 inch) incl. grounding screw, integrated DIN rail for mounting of incidentals such as terminals, automatic circuit breakers and relays
ET 200SP HA mounting rail 1500 mm (approx. 59 inch) incl. grounding screw, integrated DIN rail for mounting of incidentals such as terminals, automatic circuit breakers and relays
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 39x M16 (4.5-9 mm) for signals in 3 rows, plastic version. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 39x M16 (5-10 mm) for signals in 3 rows, metal version. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 39x M16 (4.5-9 mm) for signals in 3 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 36x M20 (7-13 mm) for signals in 3 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 65x M16 (4.5-9 mm) for signals in 5 rows, plastic version. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 65x M16 (5-10 mm) for signals in 5 rows, metal version. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 65x M16 (4.5-9 mm) for signals in 5 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 60x M20 (7-13 mm) for signals in 5 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 950x450x230, for max. 25 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 66x M16 (4.5-9 mm) for signals in 3 rows, plastic version. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 950x450x230, for max. 25 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 66x M16 (5-10 mm) for signals in 3 rows, metal version. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 950x450x230, for max. 25 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 66x M16 (4.5-9 mm) for signals in 3 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 950x450x230, for max. 25 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 57x M20 (7-13 mm) for signals in 3 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 950x450x230, for max. 25 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 110x M16 (4.5-9 mm) for signals in 5 rows, plastic version. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 950x450x230, for max. 25 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 110x M16 (5-10 mm) for signals in 5 rows, metal version. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 950x450x230, for max. 25 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 110x M16 (4.5-9 mm) for signals in 5 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2G Ex eb IIC Gb size (WxHxD): 950x450x230, for max. 25 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 95x M20 (7-13 mm) for signals in 5 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2D Ex tb IIIC Db size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 39x M16 (4.5-9 mm) for signals in 3 rows, plastic version. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2D Ex tb IIIC Db size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 39x M16 (4.5-9 mm) for signals in 3 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2D Ex tb IIIC Db size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 36x M20 (7-13 mm) for signals in 3 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2D Ex tb IIIC Db size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 65x M16 (4.5-9 mm) for signals in 5 rows, plastic version. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2D Ex tb IIIC Db size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 65x M16 (4.5-9 mm) for signals in 5 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2D Ex tb IIIC Db size (WxHxD): 650x450x230, for max. 15 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 60x M20 (7-13 mm) for signals in 5 rows, version in plastic blue. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2D Ex tb IIIC Db size (WxHxD): 950x450x230, for max. 25 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 66x M16 (4.5-9 mm) for signals in 3 rows, plastic version. ambient operating temperature -40...+70 °C
Ex enclosure made of stainless steel, IP65. Empty enclosure prepared for installation of the ET 200iSP. II 2D Ex tb IIIC Db size (WxHxD): 950x450x230, for max. 25 I/O modules. cable entries: 2x M32 power supply, 4x M20 bus cables and 66x M16 (4.5-9 mm) for signals in 3 rows, version in plastic blue. ambient operating temperature -40...+70 °C